Due to the convenience and high reliability of Sn-Pb solder, it has been widely used. However, as electronic products become lighter, thinner, and smaller, soldering technology is also becoming more complex and refined. Copper solder paste manufacturers inform that new types of solder paste are continuously being developed. Trends in foreign solder paste development:

1.Copper solder paste manufacturersinform that in the early stages of solder refinement, the solder particles were not yet formed. With the emergence of QFP devices, the solder took on a spherical shape, which later evolved into powder-like microparticles. Efforts are being made to develop solder with a particle size of less than 20 micrometers.

2. Fatigue-resistant solder paste.

Copper solder paste manufacturers inform that the traditional method to improve the fatigue resistance of solder wire is to thicken the solder to absorb fatigue stress, thereby extending the welding life. However, due to high product density and good performance, it has become difficult to achieve this goal with past methods, so the solder paste itself is required to be fatigue-resistant. To achieve this goal, rare elements have been added to the common 63Sn-1Pb alloy, which can be used like previous solders but with significantly improved fatigue resistance.

3. Lead-free solder paste

　　Copper solder paste manufacturersinforms that due to the improvement in material living standards, people's awareness of environmental protection is increasing. Some scholars have raised concerns about the toxicity of lead in solders. Copper solder paste manufacturers inform that although the amount of lead in solder is relatively low compared to other contexts, it is still a restricted substance. Foreign countries are vigorously developing lead-free solder pastes, such as the Sn-Ag-Su solder paste developed by Japan's KOKI company, which has performance similar to 63Sn-Pb37 solder paste. The melting temperature of Sn-Ag-Cu lead-free solder paste is 217°C, and the reflow temperature is 240°C, featuring non-toxicity, high-temperature resistance, and fatigue resistance; Sn-Ag-Bi-Cu lead-free solder paste has a melting temperature of 189-214°C and a reflow temperature of 230°C, with performance similar to 63Sn-Pb37.