1. After the solder paste is received, the arrival time, shelf life, model, etc. should be recorded, and acceptance should be conducted. If necessary, testing and verification should be performed according to the standards based on the inspection report provided by the supplier.

　　2.Copper solder paste manufacturerIt is advised that each batch of solder paste should be stored separately, and the first-in-first-out principle should be used when taking it out.

3. The solder paste should be sealed and stored in an environment of 5 to 10°C. If the temperature is too high, a chemical reaction may occur between the flux and alloy solder powder, increasing viscosity and affecting printability; if the temperature is too low (below 0°C), crystallization may occur in the rosin within the flux, deteriorating the properties of the solder paste.

2. Usage of copper solder paste

1. Generally, the solder paste should be taken out from the refrigerator one day before use, at least 2 hours in advance, and can only be opened after it reaches room temperature. If opened at low temperatures, it is easy to absorb moisture, which can lead to solder balls during reflow. Note that heating devices like hot air guns or air conditioners should not be used to accelerate the warming of the solder paste.

　　2.Copper solder paste manufacturerIt is advised that after opening the solder paste, observe its surface; if it has hardened or if flux has precipitated, special treatment must be performed; otherwise, it cannot be used. If the surface of the solder paste is intact, it should be slowly mixed evenly with a mixer or by hand before use. If the viscosity of the solder paste is too high and cannot smoothly pass through the mesh holes of the printing template or quantitative dispensing device, an appropriate amount of thinner should be added and mixed thoroughly before use.

3. After taking out the solder paste, the container lid should be closed properly to avoid evaporation of flux.